Термо паста Thermaltake TG-30 4G

Цена без ДДС: 12.98лв.

Цена с ДДС: 15.58лв.

Х-ка 5:

Viscosity: 76 Pa-s
Х-ка 6:

Thermal impedance: 0.185°C -in2/W
Х-ка 7:

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8:

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
Предназначен за:

Охлаждащи системи
Х-ка 2:

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3:

The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Х-ка 4:

Density: 2.55 g/cm3

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Марка: THERMALTAKE

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Х-ка 5:

Viscosity: 76 Pa-s
Х-ка 6:

Thermal impedance: 0.185°C -in2/W
Х-ка 7:

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8:

The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
Предназначен за:

Охлаждащи системи
Х-ка 2:

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3:

The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Х-ка 4:

Density: 2.55 g/cm3