Термо паста Thermaltake TG-50 4G

Цена без ДДС: 17.90лв.

Цена с ДДС: 21.48лв.

Х-ка 5:

Viscosity: 47 Pa-s
Х-ка 6:

Thermal impedance: 0.035°C -in2/W
Х-ка 7:

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8:

This thermal compound application kit includes a set of easily-applied tools for immediate use.
Предназначен за:

Охлаждащи системи
Х-ка 2:

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3:

With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
Х-ка 4:

Density: 2.9 g/cm3

направи запитване за наличност

- +

Марка: THERMALTAKE

Само попълнете 2 полета

Ние ще се свържем с вас в рамките на работния ден.

Съгласен съм с Политиката за лични данни

Х-ка 5:

Viscosity: 47 Pa-s
Х-ка 6:

Thermal impedance: 0.035°C -in2/W
Х-ка 7:

Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8:

This thermal compound application kit includes a set of easily-applied tools for immediate use.
Предназначен за:

Охлаждащи системи
Х-ка 2:

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3:

With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate.
Х-ка 4:

Density: 2.9 g/cm3